Translated title of the contribution: Mixed mismatch model predicted interfacial thermal conductance of metal/semiconductor interfaceZong, Z. C., Pan, D. K., Deng, S. C., Wan, X.,
Yang, L. N., Ma, D. K. & Yang, N.,
5 Feb 2023,
In: Wuli Xuebao/Acta Physica Sinica. 72,
3, 034401.
Research output: Contribution to journal › Review article › peer-review