Skip to main navigation
Skip to search
Skip to main content
Beijing Institute of Technology Home
English
中文
Home
Profiles
Research units
Research output
Prizes
Search by expertise, name or affiliation
View Scopus Profile
Lei Jin
School of Mechatronical Engineering
h-index
601
Citations
14
h-index
Calculated based on number of publications stored in Pure and citations from Scopus
1998
2023
Research activity per year
Overview
Fingerprint
Network
Research output
(74)
Similar Profiles
(12)
Fingerprint
Dive into the research topics where Lei Jin is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Engineering
Harvester
100%
Energy Engineering
88%
Piezoelectric
76%
Microelectromechanical System
54%
Couplings
38%
Tuning Fork
38%
Energy Harvesting
36%
Electrostatics
34%
Natural Frequency
32%
Capacitive
30%
Electret
30%
Experimental Result
26%
Output Power
25%
Simulation Result
24%
Load Resistance
23%
Transmissions
23%
Cantilever Beam
23%
Computer Simulation
21%
Perforating
19%
Rotational
15%
Nonlinear Behavior
15%
Control System
15%
Footbridges
15%
Coupled System
15%
Energy Conversion
15%
Damping Capacity
14%
Dynamic Performance
11%
Stainless Steel
11%
Target Plate
11%
Simulated Data
11%
Demonstrates
11%
Resonance Frequency
10%
Road
10%
Target Surface
10%
Magnetic Force
10%
Resonant Frequency
9%
Half Power Bandwidth
9%
Micro-Electro-Mechanical System
9%
Young's Modulus
9%
Stress Wave
9%
Finite Element Method
8%
Good Agreement
8%
Dynamic Response
8%
Impact Loads
8%
Analytical Model
8%
Surface Potential
8%
Piezoelectric Structure
7%
Nonlinearity
7%
Body Surface
7%
Diamond
7%
Material Science
Piezoelectricity
76%
Microelectromechanical System
38%
Finite Element Method
26%
Theoretical Calculation
17%
Electronic Circuit
17%
Electromechanical Coupling
15%
Density
15%
Epoxy
15%
Modal Analysis
11%
Impact Loads
9%
Diamond
7%
Piezoelectric Material
7%
Mechanical Property
7%
Multilayer
7%
Wind Induced Vibration
7%
Accelerometer
7%
Piezoelectric Ceramics
7%
Silicon Material
7%
Sensor Network
7%
Concrete (Composite Building Material)
7%
Capacitance
7%
Wearable Sensor
7%
Optical Measurement
7%
Strain Rate
5%