Calculated based on number of publications stored in Pure and citations from Scopus
20132024

Research activity per year

Network

Asen Asenov

  • Gold Standard Simulations Ltd.
  • University of Glasgow
  • Gold Standard Simulations Ltd
  • Ltd.
  • Aalto University

External person

Wendong Zhang

  • North University of China
  • Taiyuan University of Technology

External person

Dave Reid

  • Gold Standard Simulations Ltd.
  • Gold Standard Simulations Ltd
  • Ltd.

External person

Vihar Georgiev

  • University of Glasgow
  • Aalto University

External person

Hongliang Ma

  • Beijing Institute of Technology

External person

Chang He

  • Beijing Institute of Technology

External person

Campbell Millar

  • Gold Standard Simulations Ltd.
  • Gold Standard Simulations Ltd

External person

F. Adamu-Lema

  • University of Glasgow
  • Aalto University

External person

L. Gerrer

  • University of Glasgow

External person

Oves Badami

  • University of Glasgow
  • Indian Institute of Technology Hyderabad

External person

Toufik Sadi

  • Aalto University

External person

S. M. Amoroso

  • University of Glasgow
  • Gold Standard Simulations Ltd

External person

Ningfeng Ke

  • Beijing Institute of Technology

External person

Quan Liu

  • Beijing Institute of Technology

External person

Gengwu Ge

  • Beijing Institute of Technology

External person

Plamen Asenov

  • ARM Ltd.
  • University of Glasgow

External person

Gaowei Yan

  • Taiyuan University of Technology

External person

R. Hussin

  • School of Microelectronic Engineering
  • University of Glasgow
  • Universiti Malaysia Perlis

External person

Qiang Gao

  • Beijing Institute of Technology

External person

Zhe Zhang

  • Beijing Institute of Technology

External person

Jinfeng Liu

  • Taiyuan University of Technology

External person

Naoto Horiguchi

  • Interuniversitair Micro-Elektronica Centrum

External person

Liping Wang

  • University of Glasgow

External person

Xiaomin Chang

  • Taiyuan University of Technology

External person

Danielle Vanhaeren

  • Interuniversitair Micro-Elektronica Centrum

External person

Dejiang Mu

  • Taiyuan University of Technology

External person

B. Cheng

  • University of Glasgow
  • Gold Standard Simulations Ltd

External person

Paul Lapham

  • Aalto University
  • University of Glasgow

External person

Zuliang Yang

  • Taiyuan University of Technology

External person

Jacopo Franco

  • Interuniversitair Micro-Elektronica Centrum

External person

Pieter Weckx

  • Interuniversitair Micro-Elektronica Centrum

External person

Annelies Vanderheyden

  • Interuniversitair Micro-Elektronica Centrum

External person

Ben Kaczer

  • Interuniversitair Micro-Elektronica Centrum

External person

Cristina Medina-Bailon

  • University of Glasgow

External person

Daniel Nagy

  • University of Glasgow

External person

Lingjuan Che

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics
  • Taiyuan University of Technology

External person

Sayedeh Shirin Afyouni Akbari

  • Swiss Federal Institute of Technology Lausanne

External person

Hui Yang

  • CAS - Institute of Semiconductors
  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Tao Zhang

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Xiaohong Wen

  • Taiyuan University of Technology

External person

Songda Jia

  • Taiyuan University of Technology

External person

Keyu Wei

  • Taiyuan University of Technology

External person

S. Markov

  • University of Glasgow

External person

Gaohan Wang

  • Beijing Institute of Technology

External person

Xiao Chen

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Zhongming Zeng

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Longchun Ye

  • Taiyuan University of Technology

External person

Pranav Acharya

  • University of Glasgow

External person

Hulin Zhang

  • Taiyuan University of Technology

External person

Tongfei Liu

  • Beijing Institute of Technology

External person

Max C. Lemme

  • RWTH Aachen University
  • AMO GmbH
  • KTH Royal Institute of Technology
  • Uppsala University

External person

Salvatore Maria Amaroso

  • Gold Standard Simulations Ltd.

External person

Bing Ding

  • Taiyuan University of Technology

External person

Yusong Pang

  • Taiyuan University of Technology
  • Delft University of Technology

External person

Zengli Huang

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Ji Wu

  • Taiyuan University of Technology

External person

Xinying Xu

  • Taiyuan University of Technology

External person

Xiaojing Wang

  • National Innovation Institute of Defense Technology

External person

Marco Semicic

  • Interuniversitair Micro-Elektronica Centrum

External person

Beining Zhang

  • Beijing Institute of Technology

External person

Kaige Yang

  • Beijing Institute of Technology

External person

Marco Simicic

  • Interuniversitair Micro-Elektronica Centrum

External person

Ali Rezaei

  • University of Glasgow

External person

Yongdan Huang

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person

Qi Liu

  • Taiyuan University of Technology

External person

Sunan Ding

  • CAS - Suzhou Institute of Nano-Tech and Nano-Bionics

External person