@inproceedings{0f32bb5535884ba89c71489a6c7b2169,
title = "Wafer-level test system using a physical stimulus for a MEMS accelerometer",
abstract = "A wafer-level test system is proposed for a high-g MEMS accelerometer based on a probe station. To simulate a high shock on the packaged sensors, a physical stimulus is loaded on the dies using a micromechanics device. The probe-station controller is controlled by a MFC program developed within the Microsoft Visual Studio Platform. The controller is able to move with three degrees of freedom in performing the automated tests of wafers. A data acquisition board is used to receive output signals from the dies through a reliable contact between the probe card and pads. The test procedure runs a LabVIEW program for post-processing the acquired signals including evaluating computing sensitivity and other parameters. An analysis of the test results determines at the wafer-level whether the die is good. This method may be applied during manufacturing of the high-g MEMS accelerometers where the benefits are seen in reduced production costs and a shorter time to market.",
author = "Yaqiong Chen and Zhenhai Zhang and Yantao Shen and Kejie Li",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE International Conference on Real-Time Computing and Robotics, RCAR 2017 ; Conference date: 14-07-2017 Through 18-07-2017",
year = "2017",
month = jul,
day = "2",
doi = "10.1109/RCAR.2017.8311850",
language = "English",
series = "2017 IEEE International Conference on Real-Time Computing and Robotics, RCAR 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "145--150",
booktitle = "2017 IEEE International Conference on Real-Time Computing and Robotics, RCAR 2017",
address = "United States",
}