Transition among failure modes of the bending system with a stiff film on a soft substrate

Longchao Dai, Yin Huang, Hang Chen, Xue Feng*, Daining Fang

*此作品的通讯作者

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21 引用 (Scopus)

摘要

Growing interest is being attracted by stretchable and flexible electronics recently due to their attractive characteristics, commercial potentials, and engineering challenges. In comparison with the system on a macroscopic scale, different failure modes are observed in a system with a thin film bonded on an elastomeric substrate. Furthermore, the experimental observations reveal that failure modes occur in turn with the increasing of thickness ratio of the film to substrate. In this paper, theoretical analysis is performed on the failure mechanism in this system with the focus on transitions among these failure modes based on the theory of fracture mechanics. The present theoretical predictions are coincident with related experiment results and can be used to guide the related structural design.

源语言英语
文章编号021905
期刊Applied Physics Letters
106
2
DOI
出版状态已出版 - 12 1月 2015
已对外发布

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