Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization

Jun Chen; Da Miao Yu; Xiao Min Pan; Xin Qing Sheng

doi:10.23919/ACES48530.2019.9060755

Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization

Jun Chen, Da Miao Yu, Xiao Min Pan^*, Xin Qing Sheng

^*此作品的通讯作者

Beijing Institute of Technology

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

Thermoplasmonics leads to enhanced heat generation due to the localized surface plasmon resonances. In this paper, hierarchical skeletonization for differential equations (HSDE) is used to solve light absorption problems with metallic nanostructures. Numerical results show that HSDE is more efficient than MUltifrontal Massively Parallel Solver (MUMPS).

源语言	英语
主期刊名	2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019
出版商	Institute of Electrical and Electronics Engineers Inc.
ISBN（电子版）	9780996007894
DOI	https://doi.org/10.23919/ACES48530.2019.9060755
出版状态	已出版 - 8月 2019
活动	2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019 - Nanjing, 中国期限: 8 8月 2019 → 11 8月 2019

出版系列

姓名	2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019

会议

会议	2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019
国家/地区	中国
市	Nanjing
时期	8/08/19 → 11/08/19

访问文件

10.23919/ACES48530.2019.9060755

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引用此

Chen, J., Yu, D. M., Pan, X. M., & Sheng, X. Q. (2019). Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization. 在 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019 文章 9060755 (2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ACES48530.2019.9060755

Chen, Jun ; Yu, Da Miao ; Pan, Xiao Min 等. / Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization. 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019).

@inproceedings{23aac6065ab044c7abc278a960a42a14,

title = "Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization",

abstract = "Thermoplasmonics leads to enhanced heat generation due to the localized surface plasmon resonances. In this paper, hierarchical skeletonization for differential equations (HSDE) is used to solve light absorption problems with metallic nanostructures. Numerical results show that HSDE is more efficient than MUltifrontal Massively Parallel Solver (MUMPS).",

keywords = "FEM, HSDE, Light absorption, Thermoplasmonic",

author = "Jun Chen and Yu, {Da Miao} and Pan, {Xiao Min} and Sheng, {Xin Qing}",

note = "Publisher Copyright: {\textcopyright} 2019 Applied Computational Electromagnetics Society.; 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019 ; Conference date: 08-08-2019 Through 11-08-2019",

year = "2019",

month = aug,

doi = "10.23919/ACES48530.2019.9060755",

language = "English",

series = "2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019",

address = "United States",

}

Chen, J, Yu, DM, Pan, XM & Sheng, XQ 2019, Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization. 在 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019., 9060755, 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019, Institute of Electrical and Electronics Engineers Inc., 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019, Nanjing, 中国, 8/08/19. https://doi.org/10.23919/ACES48530.2019.9060755

Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization. / Chen, Jun; Yu, Da Miao; Pan, Xiao Min 等.
2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 9060755 (2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization

AU - Chen, Jun

AU - Yu, Da Miao

AU - Pan, Xiao Min

AU - Sheng, Xin Qing

PY - 2019/8

Y1 - 2019/8

N2 - Thermoplasmonics leads to enhanced heat generation due to the localized surface plasmon resonances. In this paper, hierarchical skeletonization for differential equations (HSDE) is used to solve light absorption problems with metallic nanostructures. Numerical results show that HSDE is more efficient than MUltifrontal Massively Parallel Solver (MUMPS).

AB - Thermoplasmonics leads to enhanced heat generation due to the localized surface plasmon resonances. In this paper, hierarchical skeletonization for differential equations (HSDE) is used to solve light absorption problems with metallic nanostructures. Numerical results show that HSDE is more efficient than MUltifrontal Massively Parallel Solver (MUMPS).

KW - FEM

KW - HSDE

KW - Light absorption

KW - Thermoplasmonic

UR - http://www.scopus.com/inward/record.url?scp=85083989973&partnerID=8YFLogxK

U2 - 10.23919/ACES48530.2019.9060755

DO - 10.23919/ACES48530.2019.9060755

M3 - Conference contribution

AN - SCOPUS:85083989973

T3 - 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019

BT - 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019

Y2 - 8 August 2019 through 11 August 2019

ER -

Chen J, Yu DM, Pan XM, Sheng XQ. Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization. 在 2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 9060755. (2019 International Applied Computational Electromagnetics Society Symposium-China, ACES 2019). doi: 10.23919/ACES48530.2019.9060755

Thermoplasmonic simulation of metallic nanoparticles with hierarchical skeletonization

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