Thermoelectric properties of undoped and Bi-doped GeS monolayers: A first-principles study

H. Yang*, H. L. Shi, Q. Z. Han, J. Yang, Y. H. Ren, Y. H. Zhao, L. J. Gong, Q. H. Liu, L. J. Shi, Z. T. Jiang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

摘要

Different from the extensive experimental investigations into the thermoelectric (TE) properties of the bulk IV-VI compounds, less attention has been paid to the TE properties of the monolayer IV-VI compounds. Here, we consider the TE transport properties including the Seebeck coefficient, electronic conductance, thermal conductance, power factor, and figure of merit Z T of the undoped and Bi-doped GeS monolayers. Our results show that for both the undoped and Bi-doped monolayers the anisotropy is widely observed in all their TE properties, and the maximum Z T at a certain temperature along the armchair direction is much greater than that along the zigzag direction. Moreover, Bi doping can lead to an increase of the maximum Z T , and there are more Z T peaks appearing near the zero chemical potential. This indicates that the Bi-doped GeS monolayer can work as a TE material at a lower bias voltage, and especially along the armchair direction it can work at zero bias voltage, which obviously strengthens the reliability of the TE devices. As the temperature increases, the maximum Z T will be uniformally increased along the armchair and zigzag directions for both the undoped and Bi-doped GeS monolayers. In the temperature scope from 300 to 800 K, the maximum Z T along the armchair direction of the Bi-doped GeS monolayer will increase from 3.39 to 4.85, which indicates that this Bi-doped GeS monolayer is a promising TE material in a wide-temperature zone. As an application, we have designed the GeS-based TE couples and found that their efficiencies can be greater than 27 % at large temperature differences. This research should be an important guidance for designing a low-voltage, wide-temperature-scope, and high-stability TE device.

源语言英语
文章编号174302
期刊Journal of Applied Physics
135
17
DOI
出版状态已出版 - 7 5月 2024

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