TY - GEN
T1 - Thermal reliability evaluation of PLCC packaging using scanning acoustic microscopy
AU - Guo, Xianghui
AU - Xu, Chunguang
AU - Yang, Liu
AU - Peng, Kai
PY - 2013
Y1 - 2013
N2 - Scanning acoustic microscopy (SAM) has emerged as a powerful non-destructive testing tool for microelectronic packaging testing. Under cyclical thermal loads, the microelectronic packaging is easy to produce cracks, delamination, and other defects, which can be detected using SAM. In order to study the thermal reliability of Plastic Leaded Chip Carrier (PLCC) packaging, a set of practical SAM system was developed; Then, thermal cycling test on a set of PLCC packaging was conducted according to the MIL-STD-883H Microcircuits Test Method Standard with temperature range from -65°C to 150°C. and the crack growth rate of PLCC packaging was studied experimentally using SAM. Finally, the Coffin-Manson's constitutive model was adopted to predict thermal fatigue life, which was consistent with the experimental results. With these researches, the thermal reliability of the PLCC packaging was investigated using scanning acoustic microscopy combined with accelerated thermal cycling methods.
AB - Scanning acoustic microscopy (SAM) has emerged as a powerful non-destructive testing tool for microelectronic packaging testing. Under cyclical thermal loads, the microelectronic packaging is easy to produce cracks, delamination, and other defects, which can be detected using SAM. In order to study the thermal reliability of Plastic Leaded Chip Carrier (PLCC) packaging, a set of practical SAM system was developed; Then, thermal cycling test on a set of PLCC packaging was conducted according to the MIL-STD-883H Microcircuits Test Method Standard with temperature range from -65°C to 150°C. and the crack growth rate of PLCC packaging was studied experimentally using SAM. Finally, the Coffin-Manson's constitutive model was adopted to predict thermal fatigue life, which was consistent with the experimental results. With these researches, the thermal reliability of the PLCC packaging was investigated using scanning acoustic microscopy combined with accelerated thermal cycling methods.
KW - PLCC packaging
KW - scanning acoustic microscopy
KW - thermal reliability
UR - http://www.scopus.com/inward/record.url?scp=84889632844&partnerID=8YFLogxK
U2 - 10.1109/FENDT.2013.6635531
DO - 10.1109/FENDT.2013.6635531
M3 - Conference contribution
AN - SCOPUS:84889632844
SN - 9781467360180
T3 - FENDT 2013 - Proceedings of 2013 Far East Forum on Nondestructive Evaluation/Testing: New Technology and Application
SP - 69
EP - 72
BT - FENDT 2013 - Proceedings of 2013 Far East Forum on Nondestructive Evaluation/Testing
T2 - 2013 Far East Forum on Nondestructive Evaluation/Testing: New Technology and Application, FENDT 2013
Y2 - 17 June 2013 through 20 June 2013
ER -