Thermal conductivity measurements of polyamide 12

Mengqi Yuan, David Bourell, Tim Diller

科研成果: 会议稿件论文同行评审

32 引用 (Scopus)

摘要

An important component in understanding the laser sintering process is knowledge of the thermal properties of the processed material. Thermal conductivity measurements of pure polyamide 12 were conducted based on transient plane source technology using a Hot Disk® TPS500 conductivity measurement device. Polyamide samples were packed to three different densities in nitrogen at steady state. Thermal diffusivity and conductivity were measured from 40°C to 170°C for both fresh powder and previously heated ("recycled") powder. The fresh powder tests revealed that thermal conductivity increased linearly with temperature while for previously heated powder, more constant and higher thermal conductivity was observed as it formed a powder cake. Tests were also performed on fully dense polyamide 12 to establish a baseline. Polyamide 12 powder had a room-temperature thermal conductivity of approximately 0.1 W/mK which increased with temperature, whereas the bulk laser sintered polyamide 12 room-temperature value was 0.26 W/mK and generally decreased with increasing temperature.

源语言英语
427-437
页数11
出版状态已出版 - 2011
已对外发布
活动22nd Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2011 - Austin, TX, 美国
期限: 8 8月 201110 8月 2011

会议

会议22nd Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2011
国家/地区美国
Austin, TX
时期8/08/1110/08/11

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