Thermal and corrosion behavior of Ti3C2/Copper composites

Guichen Song, Qihuang Deng, Bo Wang, Zhiduo Liu, Chen Ye, Xianzhe Wei, Dan Dai, Zhongbin Pan, Wei Li*, Shulin Song*, Li Fu, Cheng Te Lin, Nan Jiang, Jinhong Yu*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

18 引用 (Scopus)

摘要

In virtue of its excellent performance and abundant surface terminations, MXenes, a newly emerged 2D materials, greatly exhibit promising applications in many fields of energy storage and electromagnetic shielding. Ti3C2, a member of MXenes, is widely investigated in recent years. However, lack for attention in thermal property and corrosion behavior. Here, Copper matrix composites were prepared by Spark Plasma Sintering, in which TiC and few-layer Ti3C2 nanosheets as filler. The results exhibit corrosion resistance of the Ti3C2/Cu composites were improved compared to TiC/Cu composites, benefiting from outstanding electrical conductivity and easily oxidized property of Ti3C2. However, the thermal conductivity of Ti3C2/Cu composite with the content of 2 wt% Ti3C2 improves about 15% compared to TiC/Cu composites with same content, resulting from the low inherent thermal conductivity of filler and lattice mismatch between copper and filler. Moreover, the electrical resistance of Ti3C2/Cu composites increases about 100% with the content of 2 wt% Ti3C2 at interfacial contact resistance measurement compared with pure Cu. Meanwhile, the anti-corrosion performance of the Ti3C2/Cu composites was improved over pure Cu. This work will broaden appliance field of Ti3C2 and lay the foundation for the future research.

源语言英语
文章编号100498
期刊Composites Communications
22
DOI
出版状态已出版 - 12月 2020
已对外发布

指纹

探究 'Thermal and corrosion behavior of Ti3C2/Copper composites' 的科研主题。它们共同构成独一无二的指纹。

引用此