The effect of micro-spring stiffness changes on the typical MEMS S&A device

Wang Dakui*, Lou Wenzhong, Xiong Yongjia, Wang Fufu, Liu Fangyi, Jin Xin, Lu Jun

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

2 引用 (Scopus)

摘要

The purpose of this paper is to study the remove insurance time with different stiffness of typical MEMS S&A (Safety and Arming)device, which are composed of the micro spring, slider, zigzag slot and card lock. According to higher dynamics theory, the zigzag slot collision energy loss, card lock closure features such as abstract the slider in the theoretical model of motion process, we used MATLAB to work out the displacement-Time relationship of slider, and get the theoretical remove insurance time; Then we used ANSYS LS/DYNA finite element analysis of the structure, obtained the simulation process of slider displacement-Time relationship, and got the numerical remove insurance time. By comparing theoretical analysis and simulation analysis, we can get the MEMS S&A device's remove insurance time variation with spring stiffness, and verify the correctness of the simulation analysis, which provide a theoretical basis for the design of the type MEMS S&A device.

源语言英语
主期刊名2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
出版商Institute of Electrical and Electronics Engineers Inc.
413-416
页数4
ISBN(电子版)9781467366953
DOI
出版状态已出版 - 1 7月 2015
活动10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015 - Xi'an, 中国
期限: 7 4月 201511 4月 2015

出版系列

姓名2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015

会议

会议10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
国家/地区中国
Xi'an
时期7/04/1511/04/15

指纹

探究 'The effect of micro-spring stiffness changes on the typical MEMS S&A device' 的科研主题。它们共同构成独一无二的指纹。

引用此