The coupling effects of strain gradient and damage on Mode I crack tip stress fields

Haoxuan Ban, Yin Yao*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

2 引用 (Scopus)

摘要

The cleavage fracture of metallic materials is determined by the crack tip stress field depending on plastic strain gradient and microstructural damage. The synergistic effects of strain gradient and damage on the stress fields near a Mode I crack tip in metallic materials are investigated using a modified conventional theory of mechanism-based strain gradient plasticity (CMSG). Besides preserving the essence of classical CMSG, a stress-dependent damage variable is introduced to characterize the effect of microstructural damage on the material's intrinsic length, elastic modulus and plastic yielding criterion. Based on the present theoretical model, it is found that the strain gradient and microstructural damage effects both are prominent in a small region near the Mode I crack tip, at which the damage evolution is determined by the strain gradient. Although the crack tip stress field with strain gradient and damage effects is lower than the existing ones influenced only by strain gradient, it is still significantly higher compared with the yielding strength of the material so that the cleavage fracture at the crack tip can be well explained. The damage-induced stress level reduction indicates that the stress concentration at the crack tip can be alleviated to inhibit the crack propagation. As a result, when the damage effect is considered, not only a larger external load is required to induce crack propagation but also the plastic region in front of the crack tip is enlarged, consequently leading to increases of fracture strength and energy dissipation in the material. The present research provides a more precise prediction of the crack tip stress distribution in metallic materials, which is helpful for better understanding the microscopic mechanism of the cleavage fracture phenomenon.

源语言英语
文章编号103989
期刊Theoretical and Applied Fracture Mechanics
126
DOI
出版状态已出版 - 8月 2023

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