TY - GEN
T1 - The calculation method of reliability based on MEMS Safety and Arming device
AU - Fufu, Wang
AU - Wenzhong, Lou
AU - Fangyi, Liu
AU - Dakui, Wang
AU - Xin, Jin
AU - Jun, Lu
AU - Jian, Wu
AU - Xuhong, Guo
AU - Zhe, Zhang
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/1
Y1 - 2015/7/1
N2 - In this paper, aiming at the failure mode with MEMS spring fracture of MEMS S&A (Safety and Arming) device, the dynamic simulation and response surface method are combined to use to establish the relationship between the structure response and the structure random variables. The stress values are fitted by the least square method, and the binary quadratic equation, whose variables are the MEMS spring's elastic modulus, the MEMS spring's breaking strength and thickness and the output is the value of determination function, is obtained. Finally, using Monte Carlo method for a large number of random state numerical value, obtained the MEMS spring fracture of MEMS S&A device reliability is 0.9999996.
AB - In this paper, aiming at the failure mode with MEMS spring fracture of MEMS S&A (Safety and Arming) device, the dynamic simulation and response surface method are combined to use to establish the relationship between the structure response and the structure random variables. The stress values are fitted by the least square method, and the binary quadratic equation, whose variables are the MEMS spring's elastic modulus, the MEMS spring's breaking strength and thickness and the output is the value of determination function, is obtained. Finally, using Monte Carlo method for a large number of random state numerical value, obtained the MEMS spring fracture of MEMS S&A device reliability is 0.9999996.
KW - MEMS
KW - S&A Device
KW - The Calculation Method
UR - http://www.scopus.com/inward/record.url?scp=84939507715&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2015.7147459
DO - 10.1109/NEMS.2015.7147459
M3 - Conference contribution
AN - SCOPUS:84939507715
T3 - 2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
SP - 426
EP - 429
BT - 2015 IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
Y2 - 7 April 2015 through 11 April 2015
ER -