TY - GEN
T1 - The 3D Capacitance Modeling of Non-parallel Plates Based on Conformal Mapping
AU - Feng, Yue
AU - Zhou, Zilong
AU - Wang, Wenlong
AU - Rao, Zehong
AU - Han, Yanhui
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/4/25
Y1 - 2021/4/25
N2 - A highly accurate three-dimensional (3D) capacitance analytical model of parallel plates is important for the optimal design of electrostatic MEMS devices. However, due to constraints of fabrication processes, two parallel conducting plates are ineluctably tilted at an angle. Basically, finite element analysis (FEA) seems the preferred access to evaluate fringing effects across the non-parallel plates, while the analytical solution is not available. In this work, we present an analytical model for the 3D capacitance of a non-parallel-plate structure using the conformal mapping method. Taking the fringing effect into account, the proposed model shows a high accuracy of 95%, compared with other models.
AB - A highly accurate three-dimensional (3D) capacitance analytical model of parallel plates is important for the optimal design of electrostatic MEMS devices. However, due to constraints of fabrication processes, two parallel conducting plates are ineluctably tilted at an angle. Basically, finite element analysis (FEA) seems the preferred access to evaluate fringing effects across the non-parallel plates, while the analytical solution is not available. In this work, we present an analytical model for the 3D capacitance of a non-parallel-plate structure using the conformal mapping method. Taking the fringing effect into account, the proposed model shows a high accuracy of 95%, compared with other models.
KW - 3D capacitance model
KW - Fringing effect
KW - conformal mapping
KW - non-parallel-plate capacitor
UR - http://www.scopus.com/inward/record.url?scp=85113312652&partnerID=8YFLogxK
U2 - 10.1109/NEMS51815.2021.9451427
DO - 10.1109/NEMS51815.2021.9451427
M3 - Conference contribution
AN - SCOPUS:85113312652
T3 - Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
SP - 1264
EP - 1267
BT - Proceedings of the 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2021
Y2 - 25 April 2021 through 29 April 2021
ER -