Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes

Yingjie Ren; Junshi Li; Dong Huang; Lu Cao; Pengfei Wu; Yuanyu Huang; Zhihong Li

doi:10.1109/MEMS51670.2022.9699679

Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes

Yingjie Ren, Junshi Li, Dong Huang, Lu Cao, Pengfei Wu, Yuanyu Huang, Zhihong Li^*

^*此作品的通讯作者

前沿交叉科学研究院

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

摘要

As an emerging approach in the field of drug delivery, dissolvable microneedles have been extensively developed and applied. Most of the tips are with the conical or pyramid-shap, which allows low penetration force, but the tips are easy to slip out of the skin. Moreover, the medicine in the substrate cannot be used, resulting in waste of medicine. Based on the above problems, this paper reports a new type of substrate-free dissolvable microneedles with the barbed structure, which are prepared by modified dual-moulding processes and have the potential for mass production. Compared with the traditional conical microneedle, the barbed microneedle has stronger adhesion to the skin, and takes shorter pressing time to produce more drug dissolution amount and deeper penetration depth to ensure effective transdermal delivery.

源语言	英语
主期刊名	35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
出版商	Institute of Electrical and Electronics Engineers Inc.
页	404-407
页数	4
ISBN（电子版）	9781665409117
DOI	https://doi.org/10.1109/MEMS51670.2022.9699679
出版状态	已出版 - 2022
活动	35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 - Tokyo, 日本期限: 9 1月 2022 → 13 1月 2022

出版系列

姓名	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
卷	2022-January
ISSN（印刷版）	1084-6999

会议

会议	35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
国家/地区	日本
市	Tokyo
时期	9/01/22 → 13/01/22

访问文件

10.1109/MEMS51670.2022.9699679

其它文件与链接

链接到 Scopus 的出版物

引用此

Ren, Y., Li, J., Huang, D., Cao, L., Wu, P., Huang, Y., & Li, Z. (2022). Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes. 在 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 (页码 404-407). (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2022-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS51670.2022.9699679

Ren, Yingjie ; Li, Junshi ; Huang, Dong 等. / Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes. 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022. Institute of Electrical and Electronics Engineers Inc., 2022. 页码 404-407 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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title = "Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes",

abstract = "As an emerging approach in the field of drug delivery, dissolvable microneedles have been extensively developed and applied. Most of the tips are with the conical or pyramid-shap, which allows low penetration force, but the tips are easy to slip out of the skin. Moreover, the medicine in the substrate cannot be used, resulting in waste of medicine. Based on the above problems, this paper reports a new type of substrate-free dissolvable microneedles with the barbed structure, which are prepared by modified dual-moulding processes and have the potential for mass production. Compared with the traditional conical microneedle, the barbed microneedle has stronger adhesion to the skin, and takes shorter pressing time to produce more drug dissolution amount and deeper penetration depth to ensure effective transdermal delivery.",

keywords = "Barbed structure, Dissolvable microneedles, Drug delivery, Transdermal",

author = "Yingjie Ren and Junshi Li and Dong Huang and Lu Cao and Pengfei Wu and Yuanyu Huang and Zhihong Li",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 ; Conference date: 09-01-2022 Through 13-01-2022",

year = "2022",

doi = "10.1109/MEMS51670.2022.9699679",

language = "English",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

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booktitle = "35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022",

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Ren, Y, Li, J, Huang, D, Cao, L, Wu, P, Huang, Y & Li, Z 2022, Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes. 在 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 卷 2022-January, Institute of Electrical and Electronics Engineers Inc., 页码 404-407, 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022, Tokyo, 日本, 9/01/22. https://doi.org/10.1109/MEMS51670.2022.9699679

Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes. / Ren, Yingjie; Li, Junshi; Huang, Dong 等.
35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022. Institute of Electrical and Electronics Engineers Inc., 2022. 页码 404-407 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2022-January).

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

TY - GEN

T1 - Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes

AU - Ren, Yingjie

AU - Li, Junshi

AU - Huang, Dong

AU - Cao, Lu

AU - Wu, Pengfei

AU - Huang, Yuanyu

AU - Li, Zhihong

PY - 2022

Y1 - 2022

N2 - As an emerging approach in the field of drug delivery, dissolvable microneedles have been extensively developed and applied. Most of the tips are with the conical or pyramid-shap, which allows low penetration force, but the tips are easy to slip out of the skin. Moreover, the medicine in the substrate cannot be used, resulting in waste of medicine. Based on the above problems, this paper reports a new type of substrate-free dissolvable microneedles with the barbed structure, which are prepared by modified dual-moulding processes and have the potential for mass production. Compared with the traditional conical microneedle, the barbed microneedle has stronger adhesion to the skin, and takes shorter pressing time to produce more drug dissolution amount and deeper penetration depth to ensure effective transdermal delivery.

AB - As an emerging approach in the field of drug delivery, dissolvable microneedles have been extensively developed and applied. Most of the tips are with the conical or pyramid-shap, which allows low penetration force, but the tips are easy to slip out of the skin. Moreover, the medicine in the substrate cannot be used, resulting in waste of medicine. Based on the above problems, this paper reports a new type of substrate-free dissolvable microneedles with the barbed structure, which are prepared by modified dual-moulding processes and have the potential for mass production. Compared with the traditional conical microneedle, the barbed microneedle has stronger adhesion to the skin, and takes shorter pressing time to produce more drug dissolution amount and deeper penetration depth to ensure effective transdermal delivery.

KW - Barbed structure

KW - Dissolvable microneedles

KW - Drug delivery

KW - Transdermal

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U2 - 10.1109/MEMS51670.2022.9699679

DO - 10.1109/MEMS51670.2022.9699679

M3 - Conference contribution

AN - SCOPUS:85126393274

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 404

EP - 407

BT - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022

Y2 - 9 January 2022 through 13 January 2022

ER -

Ren Y, Li J, Huang D, Cao L, Wu P, Huang Y 等. Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes. 在 35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022. Institute of Electrical and Electronics Engineers Inc. 2022. 页码 404-407. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMS51670.2022.9699679

Substrate-Free Dissolvable Microneedles with Barbed Structure Prepared by Modified Dual-Moulding Processes

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