Study on CTE of nano-inorganic hybrid polyimide using DSCM

Polyimide (PI) has been considered to be suitable matrix polymers for advanced technological applications in the microelectronics, aerospace, machine industries, due to it possess excellent chemical, physical, thermal and mechanical properties. And, nano-inorganic hybrid polyimide, acquired by introducing nanometer material into the PI matrix, has more excellent behavior due to some properties of nano-inorganic granule such as low water-absorbing and low coefficient of thermal expansion (CTE). Thermal deformation of nano-inorganic hybrided polyimide at varied temperature was measured using the digital speckle correlation method (DSCM). And then, the CTE was calculated. In the experiment, the behavior of the PI films mixed with the different density of clay, mica and silica was studied and the experimental result was analyzed.