TY - GEN
T1 - Preparation of heat-resistant enameled wire coating of fluorinated poly (ether ether ketone) and properties
AU - Gui, Ting
AU - Zhao, Yun
AU - Jiao, Qing Ze
AU - Li, Han Sheng
AU - Wu, Qin
N1 - Publisher Copyright:
© (2014) Trans Tech Publications, Switzerland.
PY - 2014
Y1 - 2014
N2 - The soluble poly(ether ether ketone) (PEEK) containing trifluoromethyl group (FPEEK) was prepared by nucleophilic polycondensation reaction of 4, 4'-difluorobenzophenone and 4, 4′-(hexafluoroisopropylidene)diphenol in the presence of an excess of anhydrous K2CO3 with tetramethylene sulfone as the solvent. The structure and thermal stability of FPEEK were studied by Fourier transform infrared spectroscopy, nuclear magnetic resonance spectroscopy, X-ray diffractometer and thermogravimetric analyzer. The solubility of FPEEK was also investigated using different organic solvents. Then the solution of FPEEK in N, N-dimethylformamide (DMF) was applied to prepare insulating coating. The mechanical properties of the coating were tested. The results show that FPEEK is soluble in common organic solvents such as chloroform, tetrahydrofuran and DMF. FPEEK shows high thermal stability with the initial degradation temperature of 536 °C in nitrogen. The insulating coatings of FPEEK exhibit the good adhesion, flexibility and impact resistance.
AB - The soluble poly(ether ether ketone) (PEEK) containing trifluoromethyl group (FPEEK) was prepared by nucleophilic polycondensation reaction of 4, 4'-difluorobenzophenone and 4, 4′-(hexafluoroisopropylidene)diphenol in the presence of an excess of anhydrous K2CO3 with tetramethylene sulfone as the solvent. The structure and thermal stability of FPEEK were studied by Fourier transform infrared spectroscopy, nuclear magnetic resonance spectroscopy, X-ray diffractometer and thermogravimetric analyzer. The solubility of FPEEK was also investigated using different organic solvents. Then the solution of FPEEK in N, N-dimethylformamide (DMF) was applied to prepare insulating coating. The mechanical properties of the coating were tested. The results show that FPEEK is soluble in common organic solvents such as chloroform, tetrahydrofuran and DMF. FPEEK shows high thermal stability with the initial degradation temperature of 536 °C in nitrogen. The insulating coatings of FPEEK exhibit the good adhesion, flexibility and impact resistance.
KW - Enameled wire
KW - Fluorinated poly (ether ether ketone)
KW - Heat resistance
KW - Solubility
UR - http://www.scopus.com/inward/record.url?scp=84920834121&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.1035.432
DO - 10.4028/www.scientific.net/AMR.1035.432
M3 - Conference contribution
AN - SCOPUS:84920834121
T3 - Advanced Materials Research
SP - 432
EP - 436
BT - Proceedings of 2014 International Conference on Material Science and Engineering
A2 - Chen, Ping
PB - Trans Tech Publications Ltd.
T2 - 2014 International Conference on Material Science and Engineering, ICMSE2014
Y2 - 8 August 2014 through 9 August 2014
ER -