Power-aware high level evaluation model of interconnect length of on-chip memory network topology

Xiao Jun Wang, Feng Shi*, Yi Zhuo Wang, Hong Zhang, Xu Chen, Wen Fei Fu

*此作品的通讯作者

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4 引用 (Scopus)
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摘要

Interconnect power is the factor that dominates the power consumption on the on-chip memory architecture. Almost all dedicated wires and buses are replaced with packet switching interconnection networks which have become the standard approach to on-chip interconnection. Unfortunately, rapid advances in technology are making it more difficult to assess the interconnect power consumption of NoC. To resolve this problem, a new evaluating methodology for interconnect power evaluation based on topology of on-chip memory (IPETOM) is proposed in this paper. To validate this method, two multicore architectures 2D-mesh and triplet-based architecture (TriBA) are evaluated in this research work. The on-chip memory network model is evaluated based on characteristics of on-chip architecture interconnection. MATLAB is used for conducting the experiment that evaluates the interconnection power of TriBA and 2D-mesh.

源语言英语
页(从-至)422-431
页数10
期刊International Journal of Computational Science and Engineering
17
4
DOI
出版状态已出版 - 2018

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Wang, X. J., Shi, F., Wang, Y. Z., Zhang, H., Chen, X., & Fu, W. F. (2018). Power-aware high level evaluation model of interconnect length of on-chip memory network topology. International Journal of Computational Science and Engineering, 17(4), 422-431. https://doi.org/10.1504/IJCSE.2018.096030