On the GPU Parallel Computing for Sommerfeld Integral Tails

Xin Yuan, Chao Ze Yan, Bi Yi Wu*, Ming Lin Yang, Xin Qing Sheng

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The Sommerfeld integrals (SIs) in layered media are notoriously difficult to calculate due to their oscillatory nature, and their evaluation can require a significant amount of computational resources. This letter investigates the acceleration of numerical integrations of SIs by using the(GPU) processor. With the advent of high-performance computing architectures, such as graphics processing units (GPUs), it has become possible to accelerate SI evaluation, leveraging the parallelism inherent in these architectures. By distributing the workload across a large number of processing units, GPUs can significantly reduce the computational time required to evaluate these integrals. Implemented using the CUDA platform, up to 24 times speedup is achieved compared to a state-of-art multicore CPU with OpenMP parallelism. We render the proposed method can be applied to a wide range of problems in electromagnetics, acoustics, and optics, among other fields.

源语言英语
主期刊名2023 IEEE International Workshop on Electromagnetics
主期刊副标题Applications and Student Innovation Competition, iWEM 2023
出版商Institute of Electrical and Electronics Engineers Inc.
370-372
页数3
ISBN(电子版)9798350336740
DOI
出版状态已出版 - 2023
活动2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, iWEM 2023 - Harbin, 中国
期限: 15 7月 202318 7月 2023

出版系列

姓名2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, iWEM 2023

会议

会议2023 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, iWEM 2023
国家/地区中国
Harbin
时期15/07/2318/07/23

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