TY - GEN
T1 - Multiplatform Visualization Technology for 3D Scene of High-Viscosity-Materials Mixing Process
AU - Xinyi, Li
AU - De'Er, Yi
AU - Wensheng, Deng
AU - Dinghua, Li
AU - Qi, Chen
AU - Rongjie, Yang
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - To ensure production quality and safety in the mixing process of highly viscous materials, it is very crucial to monitor and visualize process data parameters. The issues with existing 3D simulation and visualization software were examined, and a data visualization technology for the mixing process, based on the JME3 platform, was proposed. Important parameters including temperature, noise, vibration, and torque, were visualized in real-time using a 3D simulation model. Finally we have achieved the integration of virtual reality technology and data visualization for mixing process of highly viscous materials. The software is compatible with multiple systems and mobile devices, significantly enhancing the monitoring of the high-viscosity-materials mixing process and ensuring process safety and reliability.
AB - To ensure production quality and safety in the mixing process of highly viscous materials, it is very crucial to monitor and visualize process data parameters. The issues with existing 3D simulation and visualization software were examined, and a data visualization technology for the mixing process, based on the JME3 platform, was proposed. Important parameters including temperature, noise, vibration, and torque, were visualized in real-time using a 3D simulation model. Finally we have achieved the integration of virtual reality technology and data visualization for mixing process of highly viscous materials. The software is compatible with multiple systems and mobile devices, significantly enhancing the monitoring of the high-viscosity-materials mixing process and ensuring process safety and reliability.
KW - High-viscosity materials
KW - Multiplatform
KW - Virtual simulation
KW - Visualization of mixing process
UR - http://www.scopus.com/inward/record.url?scp=85175059650&partnerID=8YFLogxK
U2 - 10.1109/ICSECE58870.2023.10263467
DO - 10.1109/ICSECE58870.2023.10263467
M3 - Conference contribution
AN - SCOPUS:85175059650
T3 - 2023 IEEE International Conference on Sensors, Electronics and Computer Engineering, ICSECE 2023
SP - 1417
EP - 1420
BT - 2023 IEEE International Conference on Sensors, Electronics and Computer Engineering, ICSECE 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE International Conference on Sensors, Electronics and Computer Engineering, ICSECE 2023
Y2 - 18 August 2023 through 20 August 2023
ER -