TY - GEN
T1 - Modeling and characteristic of the vertical bonding-wire interconnection in Ka-band
AU - An, Dawei
AU - Li, Xiang
AU - Mou, Jinchao
AU - Lv, Xin
PY - 2008
Y1 - 2008
N2 - This paper announced a new type of bonding interconnect - vertical bonding interconnect. Bonding interconnect is the critical technique for realizing the interconnection of microwave chip. The height, distance, number of wires and joint space of bonding interconnect have important effects on its microwave characteristics. In this paper, commercial 3D electromagnetic analysis software HFSS, microwave circuit design software ADS and Agilent vector network analyzer were used to model, simulate and optimize for the microwave characteristics of bonding interconnect, and produce the model, experimental results shown in this paper.
AB - This paper announced a new type of bonding interconnect - vertical bonding interconnect. Bonding interconnect is the critical technique for realizing the interconnection of microwave chip. The height, distance, number of wires and joint space of bonding interconnect have important effects on its microwave characteristics. In this paper, commercial 3D electromagnetic analysis software HFSS, microwave circuit design software ADS and Agilent vector network analyzer were used to model, simulate and optimize for the microwave characteristics of bonding interconnect, and produce the model, experimental results shown in this paper.
KW - Microwave chip
KW - Stacked die package
KW - Vertical bonding wire interconnection
UR - http://www.scopus.com/inward/record.url?scp=50449099882&partnerID=8YFLogxK
U2 - 10.1109/GSMM.2008.4534607
DO - 10.1109/GSMM.2008.4534607
M3 - Conference contribution
AN - SCOPUS:50449099882
SN - 9781424418855
T3 - 2008 Global Symposium on Millimeter Waves, Proceeding, GSMM 2008
SP - 229
EP - 232
BT - 2008 Global Symposium on Millimeter Waves, Proceeding, GSMM 2008
PB - IEEE Computer Society
T2 - 2008 Global Symposium on Millimeter Waves, GSMM 2008
Y2 - 21 April 2008 through 24 April 2008
ER -