摘要
The microstructure of 2.5D C/SiC composite was characterized in terms of fiber architecture and processing-induced cracks. A geometric model of the weave architecture, which can be used for visualization and further qualitative analysis, was generated. Tension tests along the warp and weft directions were conducted at room temperature. The results show that the stress-strain curves exhibit mostly nonlinear behavior. Microstructural observations reveal that the differences in tensile behavior between two loading directions are attributed to the characteristics of the weave architecture.
源语言 | 英语 |
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页(从-至) | 1967-1971 |
页数 | 5 |
期刊 | Scripta Materialia |
卷 | 54 |
期 | 11 |
DOI | |
出版状态 | 已出版 - 6月 2006 |
已对外发布 | 是 |