Micromachined 60 GHz postsupported patch antenna with flip-chip interconnect

Changjiang Deng*, Wendong Liu, Qing Hao, Zhenghe Feng

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

1 引用 (Scopus)

摘要

This letter presents the design of a micromachined patch antenna operating at 60-GHz band. The radiating patch and the feedline network are designed on the quartz glass (SiO2) and silicon (Si) substrate layers, respectively. An air gap, which is supported by four nonconductive posts and one solder ball, is added between the two substrate layers to reduce dielectric loss. The utilization of transparent quartz glass is helpful in alignment, and the feedline network is universal in patch array design. A 1 × 2 patch array is designed to verify the concept of array design. The measured -10 dB bandwidth of the proposed array is 2.7 GHz (56.5-59.2 GHz).

源语言英语
页(从-至)2706-2710
页数5
期刊Microwave and Optical Technology Letters
57
11
DOI
出版状态已出版 - 1 11月 2015
已对外发布

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