TY - JOUR
T1 - Mechanism of surface formation for two-dimensional ultrasonic vibration assisted grinding of monocrystal silicon with vertical workpiece vibration
AU - Liang, Zhiqiang
AU - Wang, Xibin
AU - Wu, Yongbo
AU - Zhao, Wenxiang
AU - Peng, Yunfeng
PY - 2010/10/5
Y1 - 2010/10/5
N2 - The mechanism of surface formation for two-dimensional elliptic ultrasonic vibration assisted grinding with the vertical direction to workpiece is investigated by grinding experiments and single point diamond abrasive scratching experiments on monocrystal silicon. The vibrator is produced by bonding a PZT on a metal elastic body, frequencies of both longitudinal mode and bending mode are nearly the same, and an elliptic motion occurs when two alternating current signals with phase difference are applied to the PZT. The experimental results show that the workpiece surface quality is improved obviously, and the surface roughness is decreased significantly. And moreover, the grinding grooves become much shallower and wider, and the chip is also much thicker and shorter. It is known that the percent of ductile mode removal material increases. In addition, as the relation between vibration amplitude and grinding depth of cut is changed, two kinds of material removal mechanism, continuous contact and interrupting cutting, can be realized.
AB - The mechanism of surface formation for two-dimensional elliptic ultrasonic vibration assisted grinding with the vertical direction to workpiece is investigated by grinding experiments and single point diamond abrasive scratching experiments on monocrystal silicon. The vibrator is produced by bonding a PZT on a metal elastic body, frequencies of both longitudinal mode and bending mode are nearly the same, and an elliptic motion occurs when two alternating current signals with phase difference are applied to the PZT. The experimental results show that the workpiece surface quality is improved obviously, and the surface roughness is decreased significantly. And moreover, the grinding grooves become much shallower and wider, and the chip is also much thicker and shorter. It is known that the percent of ductile mode removal material increases. In addition, as the relation between vibration amplitude and grinding depth of cut is changed, two kinds of material removal mechanism, continuous contact and interrupting cutting, can be realized.
KW - Elliptical ultrasonic vibration
KW - Grinding chip
KW - Single point diamond scratching
KW - Surface roughness
UR - http://www.scopus.com/inward/record.url?scp=78449265756&partnerID=8YFLogxK
U2 - 10.3901/JME.2010.19.171
DO - 10.3901/JME.2010.19.171
M3 - Article
AN - SCOPUS:78449265756
SN - 0577-6686
VL - 46
SP - 171
EP - 176
JO - Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering
JF - Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering
IS - 19
ER -