Mechanism of surface formation for two-dimensional ultrasonic vibration assisted grinding of monocrystal silicon with vertical workpiece vibration

Zhiqiang Liang*, Xibin Wang, Yongbo Wu, Wenxiang Zhao, Yunfeng Peng

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

11 引用 (Scopus)

摘要

The mechanism of surface formation for two-dimensional elliptic ultrasonic vibration assisted grinding with the vertical direction to workpiece is investigated by grinding experiments and single point diamond abrasive scratching experiments on monocrystal silicon. The vibrator is produced by bonding a PZT on a metal elastic body, frequencies of both longitudinal mode and bending mode are nearly the same, and an elliptic motion occurs when two alternating current signals with phase difference are applied to the PZT. The experimental results show that the workpiece surface quality is improved obviously, and the surface roughness is decreased significantly. And moreover, the grinding grooves become much shallower and wider, and the chip is also much thicker and shorter. It is known that the percent of ductile mode removal material increases. In addition, as the relation between vibration amplitude and grinding depth of cut is changed, two kinds of material removal mechanism, continuous contact and interrupting cutting, can be realized.

源语言英语
页(从-至)171-176
页数6
期刊Jixie Gongcheng Xuebao/Chinese Journal of Mechanical Engineering
46
19
DOI
出版状态已出版 - 5 10月 2010

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