TY - JOUR
T1 - Large-Scale Synthesis of Colloidal Si Nanocrystals and Their Helium Plasma Processing into Spin-On, Carbon-Free Nanocrystalline Si Films
AU - Mohapatra, Pratyasha
AU - Mendivelso-Perez, Deyny
AU - Bobbitt, Jonathan M.
AU - Shaw, Santosh
AU - Yuan, Bin
AU - Tian, Xinchun
AU - Smith, Emily A.
AU - Cademartiri, Ludovico
N1 - Publisher Copyright:
© 2018 American Chemical Society.
PY - 2018/6/20
Y1 - 2018/6/20
N2 - This paper describes a simple approach to the large-scale synthesis of colloidal Si nanocrystals and their processing into spin-on carbon-free nanocrystalline Si films. The synthesized silicon nanoparticles are capped with decene, dispersed in hexane, and deposited on silicon substrates. The deposited films are exposed to nonoxidizing room-temperature He plasma to remove the organic ligands without adversely affecting the silicon nanoparticles to form crack-free thin films. We further show that the reactive ion etching rate in these films is 1.87 times faster than that for single-crystalline Si, consistent with a simple geometric argument that accounts for the nanoscale roughness caused by the nanoparticle shape.
AB - This paper describes a simple approach to the large-scale synthesis of colloidal Si nanocrystals and their processing into spin-on carbon-free nanocrystalline Si films. The synthesized silicon nanoparticles are capped with decene, dispersed in hexane, and deposited on silicon substrates. The deposited films are exposed to nonoxidizing room-temperature He plasma to remove the organic ligands without adversely affecting the silicon nanoparticles to form crack-free thin films. We further show that the reactive ion etching rate in these films is 1.87 times faster than that for single-crystalline Si, consistent with a simple geometric argument that accounts for the nanoscale roughness caused by the nanoparticle shape.
KW - carbon free
KW - colloidal nanoparticle
KW - helium plasma
KW - large-scale synthesis
KW - nanocrystalline Si film
UR - http://www.scopus.com/inward/record.url?scp=85047999871&partnerID=8YFLogxK
U2 - 10.1021/acsami.8b03771
DO - 10.1021/acsami.8b03771
M3 - Article
C2 - 29847722
AN - SCOPUS:85047999871
SN - 1944-8244
VL - 10
SP - 20740
EP - 20747
JO - ACS Applied Materials and Interfaces
JF - ACS Applied Materials and Interfaces
IS - 24
ER -