摘要
Cu/Ag nanostructured multilayered films (NMFs) with different stacking sequences were investigated by synchrotron X-ray diffraction during the tensile deformations for interface stress study. The lattice strains were carefully traced and the stress partition, which usually occurs in the multiphase bulk metallic materials during plastic deformations, was first quantitatively analyzed in the NMFs here. The interface stress of the Cu/Ag NMFs was carefully analyzed during the tensile deformation and the results revealed that the interface stress was along the loading direction and exhibited three-stage evolution. This tensile interface stress has a detrimental effect on the deformation, leading to the early fracture of the NMFs.
源语言 | 英语 |
---|---|
文章编号 | 221907 |
期刊 | Applied Physics Letters |
卷 | 105 |
期 | 22 |
DOI | |
出版状态 | 已出版 - 1 12月 2014 |