Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation

R. Su, L. Li*, Z. H. Nie, Q. H. Zhang, Y. D. Wang, X. T. Zhou, Y. D. Wu, X. D. Hui, X. J. Li, M. G. Wang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

3 引用 (Scopus)

摘要

Cu/Ag nanostructured multilayered films (NMFs) with different stacking sequences were investigated by synchrotron X-ray diffraction during the tensile deformations for interface stress study. The lattice strains were carefully traced and the stress partition, which usually occurs in the multiphase bulk metallic materials during plastic deformations, was first quantitatively analyzed in the NMFs here. The interface stress of the Cu/Ag NMFs was carefully analyzed during the tensile deformation and the results revealed that the interface stress was along the loading direction and exhibited three-stage evolution. This tensile interface stress has a detrimental effect on the deformation, leading to the early fracture of the NMFs.

源语言英语
文章编号221907
期刊Applied Physics Letters
105
22
DOI
出版状态已出版 - 1 12月 2014

指纹

探究 'Interface stress development in the Cu/Ag nanostructured multilayered film during the tensile deformation' 的科研主题。它们共同构成独一无二的指纹。

引用此