Interface evolution mechanism and mechanical properties of Ti311/TC4 laminated composites during hot-pressing diffusion bonding

Jingjiu Yuan, Qunbo Fan*, Weifeng Liu, Shun Xu, Lin Yang, Xingwang Cheng, Hongmei Zhang, Qianyun Yan, Le Wang, Junjie Zhang

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摘要

The dual-hardness titanium alloy laminated composites exhibit high hardness and toughness, making it an ideal material for applications in ballistic protection, wear-resistant and other fields. However, the substantial difference in hardness poses a challenge in effectively bonding these alloys, potentially resulting in the emergence of cracks and a decrease in bonding strength. In this study, a new Ti5Si3-reinforced high-hardness Ti311 (475 HV) and TC4 (352 HV) titanium alloys were successfully combined by hot-pressing diffusion bonding. The synergy effects of hot-pressing temperature and deformation on the microstructural evolution and mechanical properties of the Ti311/TC4 interface were systematically studied. The metallurgical bonding interface was formed at 850 °C under 25 MPa of 15.9% deformation, with the maximum shear strength value of 606 MPa. Moreover, a continuous and discontinuous coupled dynamic recrystallization mechanism was revealed. Deformed α grains were transformed to fine recrystallized grains, and gradually grew with the help of continuous dynamic recrystallization to eliminate the original flat interface. In addition, with the occurrence of element diffusion, the interface between Ti311 and TC4 is ultimately successfully bonded. Notably, the Ti5Si3 phase played a double-edge sword effect on bonding the Ti311/TC4 interface, promoting the occurrence of continuous dynamic recrystallization of adjacent α phase in TC4, but having negative effects on element diffusion.

源语言英语
文章编号113900
期刊Materials Characterization
211
DOI
出版状态已出版 - 5月 2024

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Yuan, J., Fan, Q., Liu, W., Xu, S., Yang, L., Cheng, X., Zhang, H., Yan, Q., Wang, L., & Zhang, J. (2024). Interface evolution mechanism and mechanical properties of Ti311/TC4 laminated composites during hot-pressing diffusion bonding. Materials Characterization, 211, 文章 113900. https://doi.org/10.1016/j.matchar.2024.113900