摘要
A way of measuring the in situ high temperature creep deformation of a micro-structure with a metal film wire on a flexible membrane is developed. The creep deformation measurement of a micro-structure with a Karma alloy wire on a polyimide membrane is used as an application. High temperature gratings were fabricated directly on the surfaces of two Karma alloy wires using the focused ion beam milling technique after the grating frequencies were designed. The grating morphologies with different isothermal soaking time were recorded by a scanning electron microscope with a heating apparatus. The in situ high temperature creep deformations in a micro-region of the structure were measured by performing the geometric phase analysis. The creep behaviors of this structure at 300 °C and 500 °C were analyzed. The developed measurement method is prospective in evaluating the reliability of the film-wire/substrate structures at a high temperature.
源语言 | 英语 |
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页(从-至) | 652-657 |
页数 | 6 |
期刊 | Microelectronics Reliability |
卷 | 53 |
期 | 4 |
DOI | |
出版状态 | 已出版 - 4月 2013 |