TY - JOUR
T1 - High-Fidelity, High-Performance Computational Algorithms for Intrasystem Electromagnetic Interference Analysis of IC and Electronics
AU - Peng, Zhen
AU - Shao, Yang
AU - Gao, Hong Wei
AU - Wang, Shu
AU - Lin, Shen
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/5
Y1 - 2017/5
N2 - Ever-increasing complexity in high-speed electronic devices and systems presents significant computational challenges in the numerical analysis in terms of desired accuracy, efficiency, and scalable parallelism. The objective of this paper is to investigate high-resolution, high-performance full-wave field solvers for scalable electromagnetic simulations of product-level integrated circuits (ICs) and electronics. The emphasis is placed on advancing parallel algorithms that are provably scalable facilitating a design-through-analysis paradigm, and enabling concurrent multiscale modeling and computation. The capability and the benefits of the algorithms are validated and illustrated through complex 3-D IC and electronics applications.
AB - Ever-increasing complexity in high-speed electronic devices and systems presents significant computational challenges in the numerical analysis in terms of desired accuracy, efficiency, and scalable parallelism. The objective of this paper is to investigate high-resolution, high-performance full-wave field solvers for scalable electromagnetic simulations of product-level integrated circuits (ICs) and electronics. The emphasis is placed on advancing parallel algorithms that are provably scalable facilitating a design-through-analysis paradigm, and enabling concurrent multiscale modeling and computation. The capability and the benefits of the algorithms are validated and illustrated through complex 3-D IC and electronics applications.
KW - Domain decomposition (DD) method
KW - electromagnetic interference (EMI)
KW - integrated circuit (IC)
KW - signal integrity (SI)
UR - http://www.scopus.com/inward/record.url?scp=85009865439&partnerID=8YFLogxK
U2 - 10.1109/TCPMT.2016.2636296
DO - 10.1109/TCPMT.2016.2636296
M3 - Article
AN - SCOPUS:85009865439
SN - 2156-3950
VL - 7
SP - 653
EP - 668
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 5
M1 - 7817743
ER -