Global Consistency Point Cloud Registration: A Multi-Path Bundle Adjustment Approach

Zhengchao Lai, Shangwei Guo, Shaokun Han*, Xuanquan Wang, Zhizhou Jia

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

We present a novel 3D point cloud registration method based on multi-path registration. The core concept involves utilizing multi-path pairwise registration for pose graph optimization, ensuring globally consistent matching poses. Challenges arise from sensor noise and outliers in overlapping regions, causing errors and incorrect matches during inter-frame registration. These cumulative errors can hinder the alignment of loop closure frames, resulting in a layered effect and a lack of global consistency in the reconstructed model. Single-path registration often relies solely on adjacent frame registration results, leading to the loss of loop closure information and constraints between frames with specific overlapping areas. The optimization method introduced in this paper constructs a graph optimization framework for multiple path registrations. It establishes consistency costs among inter-frame registration, cross-registration, and loop closure registration, tightly integrating the optimization of each frame's pose. Additionally, it assesses the registration confidence based on the similarity of point cloud color intensity information, reducing redundant registration costs to enhance robustness. Experimental results demonstrate that our approach enhances registration accuracy by at least 36.2% compared to frame-by-frame reconstruction method, showcasing its effectiveness and precision.

源语言英语
主期刊名IEEE ITAIC 2023 - IEEE 11th Joint International Information Technology and Artificial Intelligence Conference
编辑Bing Xu, Kefen Mou
出版商Institute of Electrical and Electronics Engineers Inc.
1408-1412
页数5
ISBN(电子版)9798350333664
DOI
出版状态已出版 - 2023
活动11th Joint International Information Technology and Artificial Intelligence Conference, ITAIC 2023 - Chongqing, 中国
期限: 8 12月 202310 12月 2023

出版系列

姓名IEEE Joint International Information Technology and Artificial Intelligence Conference (ITAIC)
ISSN(印刷版)2693-2865

会议

会议11th Joint International Information Technology and Artificial Intelligence Conference, ITAIC 2023
国家/地区中国
Chongqing
时期8/12/2310/12/23

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