摘要
This paper describes the design, fabrication and test results of a developed GaAs HBT power amplifier used in a mobile communication system. The circuit topology is presented. This two-stage amplifier has the associated gain of more than 30 dB and 1 dB compression output power of more than 30 dBm and the saturated output power of more than 30 dBm with the maximum power added efficiency of more than 37% at frequency 1800 MHz @ 3.6 V bias. A satisfied yield was obtained on GaAs HBT wafer in 3 inch diameter.
源语言 | 英语 |
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页(从-至) | 375-379+386 |
期刊 | Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics |
卷 | 21 |
期 | 4 |
出版状态 | 已出版 - 11月 2001 |
已对外发布 | 是 |