Full-Wave Simulation of a 10,000-Element Reconfigurable Intelligent Surface with a Single Workstation Computer

Qijian Lim, Hong Wei Gao, Zhen Peng

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

Nowadays, extensive research conducted on electromagnetic materials has led to many innovative devices and systems. While the potentials of advanced materials and their applications are appealing, it is often difficult to model them accurately by computational methods due to the inherently multiscale, complex structures involved. We propose a metamaterial Green's function with the geometry-aware domain decomposition method for modeling complex, heterogeneous materials. The outcome results in quasi-sublinear algorithms, in which the computational complexity does not depend on the microscopic size of metamaterial structures. The results have the potential to make the high-fidelity analysis of metamaterials and metasurfaces orders of magnitude faster.

源语言英语
主期刊名2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Proceedings
出版商Institute of Electrical and Electronics Engineers Inc.
587-588
页数2
ISBN(电子版)9781665442282
DOI
出版状态已出版 - 2023
活动2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Portland, 美国
期限: 23 7月 202328 7月 2023

出版系列

姓名IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
2023-July
ISSN(印刷版)1522-3965

会议

会议2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023
国家/地区美国
Portland
时期23/07/2328/07/23

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引用此

Lim, Q., Gao, H. W., & Peng, Z. (2023). Full-Wave Simulation of a 10,000-Element Reconfigurable Intelligent Surface with a Single Workstation Computer. 在 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Proceedings (页码 587-588). (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest); 卷 2023-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/USNC-URSI52151.2023.10237639