TY - JOUR
T1 - Flexible and Stretchable Strategies for Electronic Skins
T2 - Materials, Structure, and Integration
AU - Yuan, Zuqing
AU - Han, Su Ting
AU - Gao, Wenchao
AU - Pan, Caofeng
N1 - Publisher Copyright:
© 2021 American Chemical Society.
PY - 2022/1/25
Y1 - 2022/1/25
N2 - The basic materials, designs, and integration strategies have accelerated the significant development of electronic skins (E-skins). E-skins can transform skin-like sensory stimulations into various types of information. They have been utilized for wearable devices, robotics, human-machine interfaces, and prosthetics. However, there are still challenges for E-skins to support complex and subtle recognition. This review discusses the materials, structural designs, and integrated techniques for E-skins. We first introduce the common materials to fabricate E-skins. Then, we discuss the sensing mechanisms and structural engineering to establish a tactile sensor. An emphasis on how to optimize the performance is also discussed. Following that, we introduce representative progress in E-skins and focus on their integration strategies and applications. Future challenges and possible opportunities in the E-skins are discussed in the conclusion.
AB - The basic materials, designs, and integration strategies have accelerated the significant development of electronic skins (E-skins). E-skins can transform skin-like sensory stimulations into various types of information. They have been utilized for wearable devices, robotics, human-machine interfaces, and prosthetics. However, there are still challenges for E-skins to support complex and subtle recognition. This review discusses the materials, structural designs, and integrated techniques for E-skins. We first introduce the common materials to fabricate E-skins. Then, we discuss the sensing mechanisms and structural engineering to establish a tactile sensor. An emphasis on how to optimize the performance is also discussed. Following that, we introduce representative progress in E-skins and focus on their integration strategies and applications. Future challenges and possible opportunities in the E-skins are discussed in the conclusion.
KW - electronic skins
KW - flexible materials
KW - integration platform
KW - sensing mechanism
KW - stretchable structure
UR - http://www.scopus.com/inward/record.url?scp=85121974564&partnerID=8YFLogxK
U2 - 10.1021/acsaelm.1c00025
DO - 10.1021/acsaelm.1c00025
M3 - Review article
AN - SCOPUS:85121974564
SN - 2637-6113
VL - 4
SP - 1
EP - 26
JO - ACS Applied Electronic Materials
JF - ACS Applied Electronic Materials
IS - 1
ER -