Fast mask near-field calculation using fully convolution network

Jiaxin Lin, Lisong Dong, Taian Fan, Xu Ma*, Rui Chen, Yayi Wei

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

12 引用 (Scopus)

摘要

Near-field calculation for thick mask is a fundamental task in lithography simulations. This paper proposes a fully convolution network (FCN) method to improve the efficiency of three-dimensional (3D) mask near-field calculation compared to the rigorous electromagnetic field (EMF) simulation methods. Taking into account the 3D mask effects, the network is trained based on a set of mask samples and the corresponding near-field data obtained by the EMF simulator. During the testing stage, the trained FCN is used to rapidly predict the diffraction near-field of the testing mask patterns. The performance of the proposed FCN approach is evaluated by simulations based on EUV lithography.

源语言英语
主期刊名2020 4th International Workshop on Advanced Patterning Solutions, IWAPS 2020
编辑Yayi Wei, Tianchun Ye
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781728175775
DOI
出版状态已出版 - 5 11月 2020
活动4th International Workshop on Advanced Patterning Solutions, IWAPS 2020 - Chengdu, 中国
期限: 5 11月 20206 11月 2020

出版系列

姓名2020 4th International Workshop on Advanced Patterning Solutions, IWAPS 2020

会议

会议4th International Workshop on Advanced Patterning Solutions, IWAPS 2020
国家/地区中国
Chengdu
时期5/11/206/11/20

指纹

探究 'Fast mask near-field calculation using fully convolution network' 的科研主题。它们共同构成独一无二的指纹。

引用此