Experimental study on the package of high-g accelerometer

Jun Liu, Yunbo Shi, Ping Li, Jun Tang*, Rui Zhao, He Zhang

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

37 引用 (Scopus)

摘要

In this paper, the effect of the package die adhesive and package shell on the performances of silicon based MEMS high-g accelerometers was reported. Using Raman spectroscopy, the residual stress caused by different package die adhesive thickness and different package shell material was characterized. It can be concluded from the testing results that: with thicker die adhesive, the residual stress increment was much smaller; the piezoresistance variation caused by this residual stress was much smaller; and the temperature shift of the output voltage was much smaller. Comparing with the ceramic package, the stainless steel package has bigger sensitivity and bigger anti-overload ability.

源语言英语
页(从-至)1-8
页数8
期刊Sensors and Actuators A: Physical
173
1
DOI
出版状态已出版 - 1月 2012
已对外发布

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