TY - JOUR
T1 - Experimental study on the micromechanical behavior of a PBX simulant using SEM and digital image correlation method
AU - Zhou, Zhongbin
AU - Chen, Pengwan
AU - Huang, Fenglei
AU - Liu, Siqi
PY - 2011/3
Y1 - 2011/3
N2 - The micro-scale mechanical behavior of a polymer-bonded explosive (PBX) simulant was experimentally studied using a scanning electron microscope (SEM) imaging system and digital image correlation (DIC) method. The semi-circular bend (SCB) test was chosen for the study. During the testing, a series of SEM images of the specimen was acquired in situ. The natural micro-structural features of the specimen were used as random speckle pattern for DIC analysis. The displacement and strain fields at the area of interest were obtained by DIC. The deformation and damage of PBX were analyzed. Heterogeneous strain fields demonstrated the damage evolution underneath the specimen surface and predicted possible micro-crack growth. Based on the contour plots of the correlation coefficient, the formation and extension of microscopic cracks were quantitatively analyzed.
AB - The micro-scale mechanical behavior of a polymer-bonded explosive (PBX) simulant was experimentally studied using a scanning electron microscope (SEM) imaging system and digital image correlation (DIC) method. The semi-circular bend (SCB) test was chosen for the study. During the testing, a series of SEM images of the specimen was acquired in situ. The natural micro-structural features of the specimen were used as random speckle pattern for DIC analysis. The displacement and strain fields at the area of interest were obtained by DIC. The deformation and damage of PBX were analyzed. Heterogeneous strain fields demonstrated the damage evolution underneath the specimen surface and predicted possible micro-crack growth. Based on the contour plots of the correlation coefficient, the formation and extension of microscopic cracks were quantitatively analyzed.
KW - Digital image correlation
KW - Heterogeneous deformation field
KW - Micromechanical behavior
KW - Polymer bonded explosive simulant
UR - http://www.scopus.com/inward/record.url?scp=78650851718&partnerID=8YFLogxK
U2 - 10.1016/j.optlaseng.2010.11.001
DO - 10.1016/j.optlaseng.2010.11.001
M3 - Article
AN - SCOPUS:78650851718
SN - 0143-8166
VL - 49
SP - 366
EP - 370
JO - Optics and Lasers in Engineering
JF - Optics and Lasers in Engineering
IS - 3
ER -