TY - JOUR
T1 - Experimental study on brittle-ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain
AU - Liang, Zhiqiang
AU - Wang, Xibin
AU - Wu, Yongbo
AU - Xie, Lijing
AU - Jiao, Li
AU - Zhao, Wenxiang
PY - 2013
Y1 - 2013
N2 - This study is carried out to investigate the material removal characteristics in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain. The scratching experiments are performed to develop a fundamental understanding of the ductile-brittle transition mechanism during EUAG of monocrystal sapphire. An elliptical ultrasonic vibrator attached with a sapphire substrate was set up on a multi-axis CNC controlled machining center equipped with a single point diamond tool. The vibrator was constructed by bonding a piezoelectric ceramic device (PZT) having two separated electrodes on a metal elastic body, and an elliptical ultrasonic vibration was generated on the end-face of the metal elastic body when two phases of alternating current (AC) voltages with a phase difference are applied to their respective electrodes on PZT. In scratching experiments, the effects of ultrasonic vibration on the critical depth of cut ac for the ductile-brittle transition region and the material removal ratio, i.e., the ratio of the removed material volume to the machined groove volume, f ab, are investigated by the examination of the scratching groove surfaces with SEM and AFM. The obtained results show that the critical depth of cut in EUAG is much larger than that in conventional grinding without vibration (CG), and even the bigger vibration amplitude leads to a greater improvement. Although the values of fab in the ductile-brittle transition region in both EUAG and CG are less than 1, that in EUAG is bigger than that in CG. Furthermore, as the vibration amplitude increases, the value of fab is increased to eventually be close to 1. These show that it is prone to achieve a ductile mode grinding in greater vibration amplitude. It was also found that in the process there are two kinds of material removal modes, i.e., continuous cutting and discontinuous cutting modes, which are determined by the relationship between values of vibration amplitude and depth of cut. This study validates that the elliptical ultrasonic assisted grinding method is highly effective in ductile mode machining of hard and brittle materials.
AB - This study is carried out to investigate the material removal characteristics in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain. The scratching experiments are performed to develop a fundamental understanding of the ductile-brittle transition mechanism during EUAG of monocrystal sapphire. An elliptical ultrasonic vibrator attached with a sapphire substrate was set up on a multi-axis CNC controlled machining center equipped with a single point diamond tool. The vibrator was constructed by bonding a piezoelectric ceramic device (PZT) having two separated electrodes on a metal elastic body, and an elliptical ultrasonic vibration was generated on the end-face of the metal elastic body when two phases of alternating current (AC) voltages with a phase difference are applied to their respective electrodes on PZT. In scratching experiments, the effects of ultrasonic vibration on the critical depth of cut ac for the ductile-brittle transition region and the material removal ratio, i.e., the ratio of the removed material volume to the machined groove volume, f ab, are investigated by the examination of the scratching groove surfaces with SEM and AFM. The obtained results show that the critical depth of cut in EUAG is much larger than that in conventional grinding without vibration (CG), and even the bigger vibration amplitude leads to a greater improvement. Although the values of fab in the ductile-brittle transition region in both EUAG and CG are less than 1, that in EUAG is bigger than that in CG. Furthermore, as the vibration amplitude increases, the value of fab is increased to eventually be close to 1. These show that it is prone to achieve a ductile mode grinding in greater vibration amplitude. It was also found that in the process there are two kinds of material removal modes, i.e., continuous cutting and discontinuous cutting modes, which are determined by the relationship between values of vibration amplitude and depth of cut. This study validates that the elliptical ultrasonic assisted grinding method is highly effective in ductile mode machining of hard and brittle materials.
KW - Ductile-brittle transition
KW - Elliptical ultrasonic assisted grinding (EUAG)
KW - Grinding
KW - Sapphire
KW - Single abrasive scratching
UR - http://www.scopus.com/inward/record.url?scp=84878237809&partnerID=8YFLogxK
U2 - 10.1016/j.ijmachtools.2013.04.004
DO - 10.1016/j.ijmachtools.2013.04.004
M3 - Article
AN - SCOPUS:84878237809
SN - 0890-6955
VL - 71
SP - 41
EP - 51
JO - International Journal of Machine Tools and Manufacture
JF - International Journal of Machine Tools and Manufacture
ER -