TY - JOUR
T1 - Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape
AU - Chen, Ping
AU - Zhao, Xiuchen
AU - Wang, Yong
AU - Liu, Ying
AU - Li, Hong
AU - Gu, Yue
N1 - Publisher Copyright:
© 2014, Springer Science+Business Media New York.
PY - 2015/3
Y1 - 2015/3
N2 - In this research, two different Sn3.0Ag0.5Cu solder bump joints with barrel shape and hourglass shape respectively were fabricated by controlling solder process, and evolution of intermetallic compounds (IMC) between different solder joint and Cu substrate under 4 × 103 A/cm2 current stressing at 60 °C were investigated. The results indicate that both the decrease of IMC layer thickness in the cathode and the increase of IMC layer thickness in the anode of the hourglass-shaped solder bump joint were obviously slower than that of barrel-shaped solder bump joint, and the formation of the voids at cathode interface was observed in the barrel-shaped solder bump joint after current stressing for 240 h. The mean-time-to-failure (MTTF) of solder joint with hourglass-shaped bump is efficiently improved compared to that with barrel-shaped bump. Compared to that of the solder joint with barrel-shaped bump, enhancement of MTTF of the solder joint with hourglass-shaped bump is attributed to relieve current crowding in entrance and outlet of electric current.
AB - In this research, two different Sn3.0Ag0.5Cu solder bump joints with barrel shape and hourglass shape respectively were fabricated by controlling solder process, and evolution of intermetallic compounds (IMC) between different solder joint and Cu substrate under 4 × 103 A/cm2 current stressing at 60 °C were investigated. The results indicate that both the decrease of IMC layer thickness in the cathode and the increase of IMC layer thickness in the anode of the hourglass-shaped solder bump joint were obviously slower than that of barrel-shaped solder bump joint, and the formation of the voids at cathode interface was observed in the barrel-shaped solder bump joint after current stressing for 240 h. The mean-time-to-failure (MTTF) of solder joint with hourglass-shaped bump is efficiently improved compared to that with barrel-shaped bump. Compared to that of the solder joint with barrel-shaped bump, enhancement of MTTF of the solder joint with hourglass-shaped bump is attributed to relieve current crowding in entrance and outlet of electric current.
UR - http://www.scopus.com/inward/record.url?scp=84925534073&partnerID=8YFLogxK
U2 - 10.1007/s10854-014-2633-4
DO - 10.1007/s10854-014-2633-4
M3 - Article
AN - SCOPUS:84925534073
SN - 0957-4522
VL - 26
SP - 1940
EP - 1949
JO - Journal of Materials Science: Materials in Electronics
JF - Journal of Materials Science: Materials in Electronics
IS - 3
ER -