TY - JOUR
T1 - Effects of SMA filament surface nano SiO2 modification on interface bonding strength of SMA/epoxy composites
AU - Yang, Bin
AU - Lei, Hongshuai
AU - Wang, Zhenqing
AU - Zhang, Jifeng
AU - Zhou, Limin
N1 - Publisher Copyright:
©, 2015, Beijing University of Aeronautics and Astronautics (BUAA). All right reserved.
PY - 2015/10/1
Y1 - 2015/10/1
N2 - In order to investigate the interface bonding behavior of shape memory alloy (SMA) filament reinforced epoxy composites, the interfacial bonding strength of SMA filament/epoxy was tested through single fiber pull-out test firstly. The effects of embedding depth on ultimate interfacial bonding strength and the debonding behavior were analyzed emphatically. Then, using ABAQUS finite element analyses method, the changing relationship of stress distribution versus time during the SMA filament pull-out process was simulated by the element based on surface cohesive behavior. Finally, for the defect of low interfacial bonding strength of SMA/epoxy composites, the method in which nano SiO2 were used to modify the surfaces of SMA filaments was proposed to improve the interfacial bonding strength of materials, and was verified by debonding test. The results reveal that with the embedding depth increasing from 1.0 cm to 1.5 cm and 2.0 cm, the ultimate debonding load increases observably, while the average interfacial bonding strength decreases gradually. When the embedding depth of fiber is 2.0 cm, ultimate debonding appears at 0.300 s. By using the method of coating nano SiO2 particles on SMA surfaces, the surface roughness of fibers can be enhanced, and then improves the ultimate debonding strength of SMA filaments reinforced epoxy composites effectively. The conclusions provide theoretic guidances for the application of SMA filaments in real engineering fields.
AB - In order to investigate the interface bonding behavior of shape memory alloy (SMA) filament reinforced epoxy composites, the interfacial bonding strength of SMA filament/epoxy was tested through single fiber pull-out test firstly. The effects of embedding depth on ultimate interfacial bonding strength and the debonding behavior were analyzed emphatically. Then, using ABAQUS finite element analyses method, the changing relationship of stress distribution versus time during the SMA filament pull-out process was simulated by the element based on surface cohesive behavior. Finally, for the defect of low interfacial bonding strength of SMA/epoxy composites, the method in which nano SiO2 were used to modify the surfaces of SMA filaments was proposed to improve the interfacial bonding strength of materials, and was verified by debonding test. The results reveal that with the embedding depth increasing from 1.0 cm to 1.5 cm and 2.0 cm, the ultimate debonding load increases observably, while the average interfacial bonding strength decreases gradually. When the embedding depth of fiber is 2.0 cm, ultimate debonding appears at 0.300 s. By using the method of coating nano SiO2 particles on SMA surfaces, the surface roughness of fibers can be enhanced, and then improves the ultimate debonding strength of SMA filaments reinforced epoxy composites effectively. The conclusions provide theoretic guidances for the application of SMA filaments in real engineering fields.
KW - Interface modification
KW - Interfacial bonding strength
KW - Nano SiO
KW - Shape memory alloy filament
KW - Single fiber pull-out test
UR - http://www.scopus.com/inward/record.url?scp=84946410511&partnerID=8YFLogxK
U2 - 10.13801/j.cnki.fhclxb.20150302.003
DO - 10.13801/j.cnki.fhclxb.20150302.003
M3 - Article
AN - SCOPUS:84946410511
SN - 1000-3851
VL - 32
SP - 1341
EP - 1348
JO - Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
JF - Fuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
IS - 5
ER -