Effect of SiO2 nano-particles on adhesion strength of copper conductive adhesives

Tong Xiang Liang; Wen You Ma; Mao Sheng Cao

Effect of SiO₂ nano-particles on adhesion strength of copper conductive adhesives

Tong Xiang Liang^*, Wen You Ma, Mao Sheng Cao

^*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

5 引用（Scopus）

摘要

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO₂ nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO₂ nano-particles were doped. This result is attributed to the fact that SiO₂ nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.

源语言	英语
页（从-至）	225-228
页数	4
期刊	Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering
卷	21
期	1
出版状态	已出版 - 1月 2005
已对外发布	是

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abstract = "Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO2 nano-particles were doped. This result is attributed to the fact that SiO2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.",

keywords = "Adhesion strength, Conductive adhesive, Nano-particles",

author = "Liang, {Tong Xiang} and Ma, {Wen You} and Cao, {Mao Sheng}",

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T1 - Effect of SiO2 nano-particles on adhesion strength of copper conductive adhesives

AU - Liang, Tong Xiang

AU - Ma, Wen You

AU - Cao, Mao Sheng

PY - 2005/1

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N2 - Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO2 nano-particles were doped. This result is attributed to the fact that SiO2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.

AB - Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler. The effect of curing temperature, curing time, hardener content and SiO2 nano-particles on the adhesion strength was investigated. The adhesion strength reached 20 MPa when the adhesives cured at 145°C for 2 h. The adhesion strength increased to 25 MPa when the SiO2 nano-particles were doped. This result is attributed to the fact that SiO2 nano-particles disperses in the molecular chain of epoxy, which absorbs stress and energy, prevents the spreading of crack.

KW - Adhesion strength

KW - Conductive adhesive

KW - Nano-particles

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JF - Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering

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Effect of SiO2 nano-particles on adhesion strength of copper conductive adhesives

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Effect of SiO₂ nano-particles on adhesion strength of copper conductive adhesives