摘要
In order to develop high density power amplifier (PA) with small volume, low cost, and high performance, the LTCC embedded inductor was studied in this paper. Some critical parameters of packaging and interconnection of the LTCC integrated PA were simulated and optimized by using commercial 3D electromagnetic field analysis software HFSS. The gain, VSWR and the power added efficiency of the 450 MHz power amplifier module for CDMA mobile phone are 29 dB, 2: 1, and 34%, respectively. The volume of the PAM is only 6 mm × 6 mm × 1.2 mm.
| 源语言 | 英语 |
|---|---|
| 页（从-至） | 477-480 |
| 页数 | 4 |
| 期刊 | Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics |
| 卷 | 26 |
| 期 | 4 |
| 出版状态 | 已出版 - 11月 2006 |
| 已对外发布 | 是 |
指纹
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Xu, Q., Wu, J., Yang, L., Qian, F., Wang, Z., & Dai, L. (2006). Development of 450 MHz LTCC power amplifier module for CDMA mobile phone. Guti Dianzixue Yanjiu Yu Jinzhan/Research and Progress of Solid State Electronics, 26(4), 477-480.