TY - GEN
T1 - Detection resolution analysis of scanning acoustic microscopy used in electronic packaging
AU - Guo, Xiang Hui
AU - Xu, Chun Guang
AU - Yang, Liu
AU - Peng, Kai
PY - 2014
Y1 - 2014
N2 - Scanning Acoustic Microscopy(SAM) has been a powerful non-destructive testing tool used in electronic packaging and material characterization. With the development of 3D electronic packaging, internal dimensions of electronic packaging are getting more and more smaller, and the detection accuracy of existing non-destructive testing technology is far behind the requirements of manufacturing technology. In this study, a set of practical SAM system was developed independently by our Lab. And its detection resolution was analyzed using high frequency focused transducers with center frequency ranging from 20 MHz to 100MHz. The experimental results show that the lateral resolution of the ultrasonic transducer with 100MHz central frequency can reach about 40 microns, which is consistent with calculated resolution. Comparing with Sparrow criteria, Rayleigh criteria is more coherent with the experimental results.
AB - Scanning Acoustic Microscopy(SAM) has been a powerful non-destructive testing tool used in electronic packaging and material characterization. With the development of 3D electronic packaging, internal dimensions of electronic packaging are getting more and more smaller, and the detection accuracy of existing non-destructive testing technology is far behind the requirements of manufacturing technology. In this study, a set of practical SAM system was developed independently by our Lab. And its detection resolution was analyzed using high frequency focused transducers with center frequency ranging from 20 MHz to 100MHz. The experimental results show that the lateral resolution of the ultrasonic transducer with 100MHz central frequency can reach about 40 microns, which is consistent with calculated resolution. Comparing with Sparrow criteria, Rayleigh criteria is more coherent with the experimental results.
KW - Detection resolution
KW - Electronic packaging
KW - Scanning acoustic microscopy
UR - http://www.scopus.com/inward/record.url?scp=84901285602&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.536-537.272
DO - 10.4028/www.scientific.net/AMM.536-537.272
M3 - Conference contribution
AN - SCOPUS:84901285602
SN - 9783038350781
T3 - Applied Mechanics and Materials
SP - 272
EP - 275
BT - Advances in Mechatronics, Robotics and Automation II
PB - Trans Tech Publications
T2 - 2014 2nd International Conference on Mechatronics, Robotics and Automation, ICMRA 2014
Y2 - 8 March 2014 through 9 March 2014
ER -