TY - GEN
T1 - Design and Testing of MEMS Metal Bridge Solid State Switch
AU - Feng, Hengzhen
AU - Lou, Wenzhong
AU - Ding, Xuran
AU - Zheng, Fuquan
AU - Liao, Maohao
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-Actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized.
AB - In this paper, a MEMS metal bridge solid-state switch with small size, good consistency, safety and controllability is developed. The MEMS micro-Actuator designed a planar structure. There is a metal bridge structure in the device. Due to the characteristics of the metal bridge structure, the high current pulse drive signal tends to generate a large amount of Joule heat at the bridge structure of the device. In order to understand the possible failure conditions of the device, this paper analyzes the effect of such Joule heat inside the device, carries out related theoretical calculations, and uses COMSOL to complete the failure simulation analysis. At the same time, this paper has carried out reliability research on chip manufacturing, packaging and soldering process through wafer level test and device level test, and optimized the structure design. Finally, the processing and packaging of the device MEMS metal bridge solid state switch is realized.
KW - Device level test
KW - Failure simulation analysis
KW - MEMS metal bridge solid-state switch
KW - MEMS micro-Actuator
UR - http://www.scopus.com/inward/record.url?scp=85076709966&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2019.8915643
DO - 10.1109/NEMS.2019.8915643
M3 - Conference contribution
AN - SCOPUS:85076709966
T3 - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
SP - 122
EP - 127
BT - Proceedings of the 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 14th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2019
Y2 - 11 April 2019 through 14 April 2019
ER -