Design and Test of Missile-Borne Acquisition and Storage System for Magnetoelectric Sensor

Jiale Li, Tao Zeng, Li Sui*

*此作品的通讯作者

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

The magnetoelectric sensor can solve the problem of acceleration sensor signal adhesion when a large aspect ratio warhead penetrates a multi-layer protective structure at high speed to certain extent, but no missile-borne acquisition and storage system suitable for this sensor has been found. Therefore, this paper designed a magnetoelectric sensor missile-borne acquisition and storage system, which used GD32E230K8T6 as the main control chip, used the on-chip SAR-ADC to realize the analog-to-digital conversion, and used a resistor network to realize the in-phase attenuation linear transformation for the signal. The data was stored in a 256Kbit FRAM with a sampling rate of more than 100kHz and a sampling accuracy of 12bit. The test result showed that the prototype accomplished the acquisition task and the storage task, and had power-off protection with 330ms working time after power-off. The prototype can meet the requirements of missile-borne acquisition and storage.

源语言英语
主期刊名2024 3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024
出版商Institute of Electrical and Electronics Engineers Inc.
516-521
页数6
ISBN(电子版)9798350390285
DOI
出版状态已出版 - 2024
活动3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024 - Xi'an, 中国
期限: 23 8月 202425 8月 2024

出版系列

姓名2024 3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024

会议

会议3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024
国家/地区中国
Xi'an
时期23/08/2425/08/24

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引用此

Li, J., Zeng, T., & Sui, L. (2024). Design and Test of Missile-Borne Acquisition and Storage System for Magnetoelectric Sensor. 在 2024 3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024 (页码 516-521). (2024 3rd International Symposium on Semiconductor and Electronic Technology, ISSET 2024). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSET62871.2024.10779783