TY - JOUR
T1 - Curing and characteristics of N,N,N',N'-tetraepoxypropyl-4,4'- diaminodiphenylmethane epoxy resin-based buoyancy material
AU - Yu, Sizhu
AU - Li, Xiaodong
AU - Guo, Xiaoyan
AU - Li, Zhiren
AU - Zou, Meishuai
N1 - Publisher Copyright:
© 2019 by the authors.
PY - 2019
Y1 - 2019
N2 - Buoyancy material is a type of low-density and high-strength composite material which can provide sufficient buoyancy with deep submersibles. A new buoyancy material with N,N,N',N'- tetraepoxypropyl-4,4'-diaminodiphenylmethane epoxy resin (AG-80) and m-xylylenediamine (m-XDA) curing agent as matrix and hollow glass microsphere (HGM) as the filler is prepared. The temperature and time of the curing process were determined by the calculations of thermal analysis kinetics (TAK) through differential scanning calorimetry (DSC) analysis. The results show that the better mass ratio of AG-80 with m-XDA is 100/26. Combined TAK calculations and experimental results lead to the following curing process: pre-curing at 75 °C for 2 h, curing at 90 °C for 2 h, and post-curing at 100 °C for 2 h. The bulk density, compressive strength, and saturated water absorption of AG-80 epoxy resin-based buoyancy material were 0.729 g/cm3, 108.78 MPa, and 1.23%, respectively. Moreover, this type of buoyancy material can resist the temperature of 250 °C.
AB - Buoyancy material is a type of low-density and high-strength composite material which can provide sufficient buoyancy with deep submersibles. A new buoyancy material with N,N,N',N'- tetraepoxypropyl-4,4'-diaminodiphenylmethane epoxy resin (AG-80) and m-xylylenediamine (m-XDA) curing agent as matrix and hollow glass microsphere (HGM) as the filler is prepared. The temperature and time of the curing process were determined by the calculations of thermal analysis kinetics (TAK) through differential scanning calorimetry (DSC) analysis. The results show that the better mass ratio of AG-80 with m-XDA is 100/26. Combined TAK calculations and experimental results lead to the following curing process: pre-curing at 75 °C for 2 h, curing at 90 °C for 2 h, and post-curing at 100 °C for 2 h. The bulk density, compressive strength, and saturated water absorption of AG-80 epoxy resin-based buoyancy material were 0.729 g/cm3, 108.78 MPa, and 1.23%, respectively. Moreover, this type of buoyancy material can resist the temperature of 250 °C.
KW - Buoyancy material
KW - DSC
KW - Epoxy resin
KW - Thermal analysis kinetics
UR - http://www.scopus.com/inward/record.url?scp=85068517432&partnerID=8YFLogxK
U2 - 10.3390/polym11071137
DO - 10.3390/polym11071137
M3 - Article
AN - SCOPUS:85068517432
SN - 2073-4360
VL - 11
JO - Polymers
JF - Polymers
IS - 7
M1 - 1137
ER -