Cu-Ni Bimetallic Nanowires with Various Structures Originating from Ni Reduction Kinetics

Qing Liu, Yangeng Lan, Hongbin Shi, Yuling Shi, Qianqian Pan, Danlong Yang, Tao Wang*

*此作品的通讯作者

科研成果: 期刊稿件文章同行评审

摘要

Bimetallic nanowires play important roles in the fields of electronics and mechanics. However, their structure types and morphological control methods are limited, especially for systems with low lattice mismatch. Herein, for a Cu-Ni bimetallic system with lattice mismatch ratio less than 2.5%, a novel preparation approach of various Cu-Ni nanowires dominated by Ni(II) reduction kinetics is presented. With the increase of Ni(II) reduction rate, the core-shell Cu@Ni straight nanowires, the asymmetric Cu-Ni nanocurves, and asymmetric Cu-Ni nanocoils can be prepared, respectively. The formation of Cu-Ni nanowires with different structures can be divided into the growth of Cu nanowires and the deposition of Ni. The regulatory effects were revealed by establishing a kinetic model for Ni(II) reduction. For the novel Cu-Ni asymmetrically distributed nanocurves and nanocoils, the formation mechanism was proposed by considering the Cu nanowire bending due to the rearrangement of surface ligand and bending-induced symmetry breaking of Ni(II) reduction.

源语言英语
页(从-至)11992-11999
页数8
期刊Nano Letters
24
38
DOI
出版状态已出版 - 25 9月 2024
已对外发布

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