@inproceedings{5b35c096389744d78a30c54345e0d49b,
title = "Controlling BGA joint microstructures using seed crystals",
abstract = " This paper overviews methods to catalyse the nucleation of tin in BGA solder joints and explores the potential of engineering tin nucleation to control joint microstructures. A range of heterogeneous nucleants for Sn is overviewed. It is shown that CoSn 3 , PtSn 4 , PdSn 4 and IrSn 4 can all catalyse Sn nucleation and substantially reduce the nucleation undercooling. The nucleation mechanisms are discussed in terms of a crystallographic lattice matching analysis, where each nucleant is shown to have good planar matching across the closest packed planes in each crystal structure. We then demonstrate an approach to incorporate the nucleants into solder joints as seed crystals to control the orientation of the tin nucleation event. With this approach, it is possible to generate single-crystal joints all with the same c-axis orientation.",
keywords = "EBSD, Pb-free soldering, nucleation, reliability",
author = "Ma, {Z. L.} and Belyakov, {S. A.} and Xian, {J. W.} and T. Nishimura and K. Sweatman and Gourlay, {C. M.}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 7th Electronic System-Integration Technology Conference, ESTC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",
year = "2018",
month = nov,
day = "26",
doi = "10.1109/ESTC.2018.8546436",
language = "English",
series = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",
address = "United States",
}