Concurrent topology optimization of sandwich structures with multi-configuration and variable-diameter lattice infill

Wei Ji, Yingchun Bai*, Chao Jiang, Jianhua Liu, Qingdong Yan, Xu Han

*此作品的通讯作者

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摘要

The superior stiffness-to-weight and strength-to-weight mechanical advantages of sandwich structures can be fully exploited through concurrent design of entire topology, infill configuration and density, where the high-performance yet complicated structure can be fabricated through additive manufacturing. However, the emerging design challenges are concurrent design updating related to sandwich topology, infill configuration and density, which is a design problem with continuous and discrete variables mathematically. In this paper, a concurrent topology optimization is proposed for sandwich structures with multi-configuration and variable-diameter lattice infill. Three design variable fields are employed to describe the fundamental topology considering sandwich structural topology, infill configuration and density simultaneously. Corresponding material interpolation model is developed by combining DSP-based shell-infill description and multi-response latent-variable surrogate model based effective material property calculation. Two-stage design model is formulated as a rough design model considering all design variables followed by a refined design model with only infill density variables, which is developed to strictly satisfy the material allowance constraint due to the mapping between discrete infill configuration variables and continuous latent configuration variables. Corresponding sensitivities of compliance and constraint with respect to the structural topology, infill configuration and density variables are derived, and the method of moving asymptotes (MMA) is employed to solve the design model efficiently. Several numerical examples are presented to systematically demonstrate the effectiveness of the proposed approach.

源语言英语
文章编号117324
期刊Computer Methods in Applied Mechanics and Engineering
432
DOI
出版状态已出版 - 1 12月 2024

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