TY - GEN
T1 - Co-simulation Design of RF Front-End Based on Three-Dimensional Vertical Interconnection of BGA
AU - Zhong, Yudi
AU - Xu, Lixin
AU - Yang, Jiajie
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - To meet the development requirements of high density, high integration, miniaturization, and multifunctionality of microelectronic products, three-dimensional integration has become a key technology for the next generation of integrated circuits. In this paper, a three-dimensional integrated module for RF front-end working in the frequency band of 8 - 9 GHz is designed. Ball grid array (BGA) is used as the vertical interconnection structure. Through simulation optimization, the BGA structure achieved a return loss better than 24 dB and an insertion loss better than 0.11 dB within the frequency band. The feasibility of the RF front-end three-dimensional integration scheme was verified through co-simulation. The three-dimensional integrated module has a simple structure and good transmission performance, providing a reliable vertical transmission solution for RF microsystems integration.
AB - To meet the development requirements of high density, high integration, miniaturization, and multifunctionality of microelectronic products, three-dimensional integration has become a key technology for the next generation of integrated circuits. In this paper, a three-dimensional integrated module for RF front-end working in the frequency band of 8 - 9 GHz is designed. Ball grid array (BGA) is used as the vertical interconnection structure. Through simulation optimization, the BGA structure achieved a return loss better than 24 dB and an insertion loss better than 0.11 dB within the frequency band. The feasibility of the RF front-end three-dimensional integration scheme was verified through co-simulation. The three-dimensional integrated module has a simple structure and good transmission performance, providing a reliable vertical transmission solution for RF microsystems integration.
KW - ball grid array
KW - RF front-end
KW - three-dimensional integration
KW - vertical interconnection
UR - http://www.scopus.com/inward/record.url?scp=85193983151&partnerID=8YFLogxK
U2 - 10.1109/AEECA59734.2023.00103
DO - 10.1109/AEECA59734.2023.00103
M3 - Conference contribution
AN - SCOPUS:85193983151
T3 - Proceedings - 2023 International Conference on Advances in Electrical Engineering and Computer Applications, AEECA 2023
SP - 547
EP - 552
BT - Proceedings - 2023 International Conference on Advances in Electrical Engineering and Computer Applications, AEECA 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th International Conference on Advances in Electrical Engineering and Computer Applications, AEECA 2023
Y2 - 18 August 2023 through 19 August 2023
ER -