Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Yuanming Chen; Jianhui Lin; Tianyang Qiu; Wei He; Vadim V. Silberschmidt; Shouxu Wang; Ze Tan

doi:10.1016/j.matlet.2014.10.080

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Yuanming Chen, Jianhui Lin, Tianyang Qiu, Wei He^*, Vadim V. Silberschmidt, Shouxu Wang, Ze Tan

^*此作品的通讯作者

科研成果: 期刊稿件 › 文章 › 同行评审

10 引用（Scopus）

摘要

Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H₂SO₄ solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.

源语言	英语
页（从-至）	458-461
页数	4
期刊	Materials Letters
卷	139
DOI	https://doi.org/10.1016/j.matlet.2014.10.080
出版状态	已出版 - 15 1月 2015
已对外发布	是

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title = "Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition",

abstract = "Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.",

keywords = "Crystal growth, Electronic materials, Microstructure",

author = "Yuanming Chen and Jianhui Lin and Tianyang Qiu and Wei He and Silberschmidt, {Vadim V.} and Shouxu Wang and Ze Tan",

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T1 - Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

AU - Chen, Yuanming

AU - Lin, Jianhui

AU - Qiu, Tianyang

AU - He, Wei

AU - Silberschmidt, Vadim V.

AU - Wang, Shouxu

AU - Tan, Ze

PY - 2015/1/15

Y1 - 2015/1/15

N2 - Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.

AB - Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide.

KW - Crystal growth

KW - Electronic materials

KW - Microstructure

UR - http://www.scopus.com/inward/record.url?scp=84910604120&partnerID=8YFLogxK

U2 - 10.1016/j.matlet.2014.10.080

DO - 10.1016/j.matlet.2014.10.080

M3 - Article

AN - SCOPUS:84910604120

SN - 0167-577X

VL - 139

SP - 458

EP - 461

JO - Materials Letters

JF - Materials Letters

ER -

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

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